Pulse Current Deposition (or Dissolution) is a specialised, dynamic and complex method to tailor and control deposits, their composition and structure using electrical current pulses.

Indeed, pulse deposition methods are widely used for the fabrication of Circuit Boards, and Pulse Dissolution is gaining ground in polishing additively manufactured materials.

Plating Plating Seminarium is the longest continuously running symposium on this subject and brings together fundamental and applied research.

While most of preceding meetings took place in Austria, this is the first time it is moving from its home there to Glasgow, Scotland.

We encourage all ESEE attendees to join the symposium, and welcome all Pulse Plating Seminarium attendees to join us for the day!